| 摘要 |
A thermal management device comprises a fin stack 1, heat pipes 2, 3, and attachment means 7 to facilitate connection to electronic communication equipment, or other heat generating equipment. The thermal performance of the device is enhanced to ensure that the equipment will work at temperatures below 0°C. The fin design and geometry may be modified, by providing separating features 4 or incorporating separate fin stacks 5, to optimise the heat pipe performance at ambient temperatures below 0°C. Two types of heat pipes comprising conventional heat pipes 2, containing water, and alternative fluid heat pipes 3, containing a fluid that does not freeze below 0°C, may be attached between the fin stack and an evaporator block 6 connected to a heat source 8. Preferably, the heat created by the heat source is absorbed by the evaporator block and transferred to all the heat pipes such that the alternative fluid heat pipes maintain the temperature of the conventional heat pipes above 0°C to prevent freezing and enable continued operation. |
