| 摘要 |
A one chip type RF integrated module is provided to integrate circuit devices, such as a front end module, a matching circuit, a power amplifier module, and a transceiver, on a bare chip in a package chip type, thereby minimizing the size of a communication module. An RF integrated module comprises a front end module(110), a matching circuit(120), a power amplifier module(130), and a transceiver(140), which are disposed on a single substrate(150). A plurality of input and output pin patterns is formed at an end side around the substrate. The pin patterns are arranged along a circumference of the substrate in a square-shaped copper foil region while the pin patterns are distanced from each other. Die bonding patterns, wire bonding patterns, line patterns, etc., are formed on the substrate. Thus, respective components are mounted on the substrate, and input and output signal lines of the components are electrically connected to the pin patterns.
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