| 摘要 |
A deposition apparatus and the deposition method are provided to control the deposition rate and film thickness with the high precision by setting the means controlling the flow rate of the depositing material. The vacuum chamber(1) has the deposition space for performing the film growth. The material accommodation part(7) is charged with the depositing material. A plurality of pipings(8,9) supplies the depositing material(6) to the deposition space of the vacuum chamber from the material accommodation part. The fluidic control device(10) controls the flow rate of the depositing material, or blocks/opens the flow. The evaporation source(5) heats up the material accommodation part and sublimes the depositing material.
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