| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-dissipating slurry that can be manufactured at low cost, along with an electronic component that uses the slurry, capable of efficiently cooling the electronic component, by dissipating with a heatsink for cooling the electronic component, suppressed increase in the size of electronic equipment. SOLUTION: The heat dissipation slurry comprises carbon material having main component is expanded graphite, emulsion particles of thermosetting resin or thermoplastic resin as the binding material, and dispersion medium. The electronic component is equipped with a heat dissipation layer the results from pasting and drying of heat dissipation slurry. COPYRIGHT: (C)2009,JPO&INPIT
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