发明名称 TRANSFER MODULE OF ION IMPLANTATION APPARATUS
摘要 A transfer module of an ion implantation apparatus is provided to reduce the time taken for pre-aligning by configuring a plurality of pre-aligners in the transfer module, and having transfer arms of a transfer robot as many as the pre-aligners. A transfer module of an ion implantation apparatus comprises a load port(10), a transfer robot(70), a pre-aligner(80), a load shuttle(40), a loadlock(50), and an unload shuttle(60). A pod(P) with a plurality of wafers is mounted on the load port. The transfer robot has more than two transfer arms to move more than two wafers. The pre-aligner receives the wafer from the transfer robot. The load shuttle loads the wafers. The loadlock has a cassette(52) receiving the wafers from the load shuttle, supplies the wafers to a process chamber(100), and receives the wafers processed in the process chamber. The unload shuttle unloads the wafers from the cassette of the loadlock, and loads the unloaded wafers therein.
申请公布号 KR20080078137(A) 申请公布日期 2008.08.27
申请号 KR20070017784 申请日期 2007.02.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOU, DOO SANG
分类号 H01L21/265;H01L21/02 主分类号 H01L21/265
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