发明名称 VACUUM INTEGRATED MICROELECTRONIC DEVICE AND METHOD OF PRODUCTION THEREOF
摘要 FIELD: physics. ^ SUBSTANCE: vacuum integrated microelectronic device contains substrate, anode layer, separating layer with apertures, insulation layer with cathode apertures, cathode layer, emission cathodes located in apertures of isolating layer. Emission cathodes are made in the form of geometrical cylinder which external surface is combined with internal surface of cathode aperture so that lower edge of cylinder wall is located at the same level as lower surface of insulation layer or as upper surface of separating layer, the upper edge of cylinder wall having electric contact to cathodic layer, thus there is a cavity in insulation layer within interval between cylinder wall of emitting cathode and aperture edge in separating layer. ^ EFFECT: increased production reproducibility of electric characteristics of devices and increased integration density. ^ 20 cl, 22 dwg
申请公布号 RU2332745(C1) 申请公布日期 2008.08.27
申请号 RU20060141291 申请日期 2006.11.22
申请人 KRASNIKOV GENNADIJ JAKOVLEVICH;OGURTSOV OLEG FEDOROVICH;KAZUROV BORIS IVANOVICH 发明人 KRASNIKOV GENNADIJ JAKOVLEVICH;OGURTSOV OLEG FEDOROVICH;KAZUROV BORIS IVANOVICH
分类号 H01J1/30 主分类号 H01J1/30
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