发明名称 TIN BASED SOLDER FOR LOW TEMPERATURE SOLDERING
摘要 FIELD: technological processes. ^ SUBSTANCE: solder can be used for low temperature soldering of objects from coloured and ferrous metals, particularly in the production of electrical and radio equipment. The solder contains the following components, in the given mass.%: antimony 0.6-1.2, copper 0.2-1.1, nickel 0.1-0.5, cerium 0.01-0.1, bismuth 1.0-5.0, lead 0.15-1.8, tin constitutes the rest. ^ EFFECT: increased durability of soldered joints; reduced defects when soldering and considerable increase in the life time and reliability of the soldered joints. ^ 3 tbl, 3 ex
申请公布号 RU2332286(C1) 申请公布日期 2008.08.27
申请号 RU20060137044 申请日期 2006.10.19
申请人 FEDERAL'NOE GOSUDARSTVENNOE UNITARNOE PREDPRIJATIE "VSEROSSIJSKIJ NAUCHNO-ISSLEDOVATEL'SKIJ INSTITUT AVIATSIONNYKH MATERIALOV" (FGUP "VIAM") 发明人 LISITSKIJ BORIS SERAFIMOVICH;RYL'NIKOV VITALIJ SERGEEVICH;CHERKASOV ALEKSEJ FILIPPOVICH;SOLOV'EVA GALINA FEDOROVNA;LUKIN VLADIMIR IVANOVICH;SIDOROV ALEKSEJ IVANOVICH
分类号 B23K35/26;C22C13/02 主分类号 B23K35/26
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