发明名称 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
摘要 |
<p>An epoxy resin composition for semiconductor encapsulation which is for use in the resin encapsulation of semiconductor elements other than optical semiconductor elements including photoreceptors and light-emitting elements. This epoxy resin composition comprises the following ingredients (A) to (D) and has a content of ingredient (D) of 75-95% by weight based on the whole epoxy resin composition: (A) an epoxy resin, (B) a phenolic resin, (C) a specific release agent, and (D) an inorganic filler. The epoxy resin composition for semiconductor encapsulation which has improved adhesive force in application to metallic frame parts/heat radiation plates and can be inhibited from suffering separation from metallic frame parts/heat radiation plates during molding.</p> |
申请公布号 |
EP1582546(B1) |
申请公布日期 |
2008.08.27 |
申请号 |
EP20050007121 |
申请日期 |
2005.03.31 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
UCHIDA, TAKAHIRO;SHIMIZU, MASATO |
分类号 |
C08G59/62;C08G59/68;C08L63/02;C08L83/04;H01L23/00;H01L23/29;H01L23/495 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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