发明名称 |
Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work |
摘要 |
An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
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申请公布号 |
US7417078(B2) |
申请公布日期 |
2008.08.26 |
申请号 |
US20030250685 |
申请日期 |
2003.07.17 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
FUJIKI HIRONAO;TOMARU KAZUHIKO;SAKURAI IKUO;SUZUKI AKIO;MITA KUNIHIKO |
分类号 |
C01G49/00;G21F1/10;C08K3/10;C08K3/22;C08L33/00;C08L83/06;H01F1/00;H01L23/06;H01L23/373;H05K7/20;H05K9/00 |
主分类号 |
C01G49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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