发明名称 |
Multilayer board with built-in chip-type electronic component and manufacturing method thereof |
摘要 |
A chip-type electronic component built-in multilayer board includes a multilayer board including two or more layered dielectric layers and an inner conductor pattern, and a chip-type electronic component which is provided at the interface of the upper and lower dielectric layers and includes an external terminal electrode. The external terminal electrode is connected to an in-plane conductor provided at a interface via a first connection conductor extending along the chip-type electronic component in the lower direction from the interface of the upper and lower dielectric layers, and a second connection conductor extending along the chip-type electronic component in the upper direction from the interface of the upper and lower dielectric layers.
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申请公布号 |
US7417196(B2) |
申请公布日期 |
2008.08.26 |
申请号 |
US20070684147 |
申请日期 |
2007.03.09 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
WADA RYUICHIRO;IKEDA TETSUYA |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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