METHOD OF MANUFACTURING PATTERN SUBSTRATE

摘要

A method for manufacturing a pattern substrate is provided to eliminate an exposure process, a developing process, and a cleaning process by coating selectively a resist without using a mask. A resist layer is formed by coating resist ink on a region except for a region corresponding to a pattern on a substrate by using an ink-jet method(S110). A pattern layer is laminated on the substrate to cover the resist layer and the region corresponding to the pattern(S130). A pattern is formed by removing the resist layer and the pattern layer laminated on the resist layer(S140). The process for forming the pattern includes a process for removing the resist layer by etching selectively the resist layer.