| 摘要 |
A wafer polishing apparatus is provided to prevent the pores of a chuck table from being stopped up by preventing sludge from being introduced into a gap between the chuck table and a wafer. A wafer polishing apparatus includes a rotatable turntable and a plurality of chuck tables for adsorbing a wafer to be polished wherein the plurality of chuck tables are installed along the circumferential direction of the upper surface of the turntable. At least one of the plurality of chuck tables includes a table body(71) having a vacuum line, a porous chuck body(73) formed on the table body wherein the porous chuck body has a plurality of poros connected to the vacuum line, and a sludge introduction preventing part(75) for preventing sludge from being introduced into a gap between the porous chuck body and the wafer. The sludge introduction preventing part is installed near the porous chuck body, separated from the porous chuck body. An air injection hole can be formed in the table body to inject sludge introduction preventing air to an edge region of the wafer.
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