| 摘要 |
A polyamide acid solution and/or gel film is subjected to at least any one of the following processes: addition of a semiconducting inorganic filler, addition of a conductivity imparting agent, and formation of a conductive film. Thereafter, the polyamide acid contained in the polyamide acid solution or gel film is imidized. Thus, the obtained semiconducting polyimide film has surface and volume resistances satisfactorily controllable and less dependent on voltage, excellent mechanical properties, and a high elongation rate.
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