发明名称 SPUTTERING METHOD AND SPUTTERING SYSTEM
摘要 When a film is deposited by sputtering employing an AC power supply, output from the AC power supply is interrupted by detecting occurrence of arc discharge quickly and generation of particles or splash can be prevented effectively by reducing energy when arc discharge is generated. A pair of targets (41a, 41b) provided in a vacuum chamber (11) are applied with a voltage at a predetermined frequency through the AC power supply (E) while changing the polarity alternately, each target is switched alternately to an anode electrode and a cathode electrode, and plasma atmosphere is formed by generating glow discharge between the anode electrode and the cathode electrode in order to sputter each target. In this regard, output voltage waveform to the pair of targets is detected and output from the AC power supply is interrupted when the voltage drop time of the output voltage waveform is judged shorter than the normal glow discharge time.
申请公布号 KR20080078053(A) 申请公布日期 2008.08.26
申请号 KR20087016805 申请日期 2007.01.11
申请人 ULVAC, INC. 发明人 KOBAYASHI MOTOSHI;NAKAMURA HAJIME;HORISHITA YOSHIKUNI;ONO ATSUSHI;SATOU SHIGEMITSU;NAKAJIMA TOSHIO
分类号 C23C14/35;C23C14/34 主分类号 C23C14/35
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