| 摘要 |
PROBLEM TO BE SOLVED: To provide a defect method of detecting a laminating wafer for improving excellent article yield and reducing manufacture cost by precisely detecting a surface defect of the wafer due to occurrence of a void in the bonding SOI wafer. SOLUTION: The presence of scratches, minute protrusions or recesses is detected on a wafer surface before bonding by using a difference interference contrast (DIC) with a face detector. Detection results of the DIC defects are synthesized, and the presence of the occurrence of the void is determined. COPYRIGHT: (C)2010,JPO&INPIT
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