| 发明名称 |
Image sensor packaging structure |
| 摘要 |
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate.
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| 申请公布号 |
US7417293(B2) |
申请公布日期 |
2008.08.26 |
| 申请号 |
US20050222173 |
申请日期 |
2005.09.08 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHEN SHOU-LUNG;LEU FANG-JUN;YU SHAN-PU |
| 分类号 |
H01L23/02;H01L21/00;H01L27/146;H01L31/0203 |
主分类号 |
H01L23/02 |
| 代理机构 |
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