| 摘要 |
PROBLEM TO BE SOLVED: To provide a new phenol novolak resin having excellent low melt viscosity, high glass transition temperature, low hygroscopicity, high adhesiveness, heat resistance, quick curability, flame retardance etc., and suitably used for particularly electrical and electronic industries, sealing electronic parts and an epoxy resin for laminate materials, to provide an epoxidized novolak condensate obtained by epoxidizing the phenol resin and to provide a cured product of the epoxy resin prepared by reacting the condensate with a curing agent for the epoxy resin. SOLUTION: Problems are solved by the low-melt viscosity phenol novolak resin represented by general formula (1) and having 100-1,000 mPa s melt viscosity at 150°C or 10-1,900 mPa s melt viscosity at 200°C. COPYRIGHT: (C)2008,JPO&INPIT |
