发明名称 CONNECTION STRUCTURE OF ELECTRONIC SUBSTRATE AND ELECTRONIC INSTRUMENT EQUIPPED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of an electronic substrate where the quality of a product is enhanced by improving the reliability of terminal connection and can be manufactured at low cost even if having a complicated circuit constitution, and to provide an electronic instrument. SOLUTION: The connection structure of the electronic substrate includes a first substrate 1 having an electrical connection portion and a second substrate 2 which has a flexible substrate engaged with the first substrate 1. The second substrate has a bent portion 22 which generates a returning force on account of its bent part and forms a portion engaged with the first substrate 1 at the bent portion so that the returning force is applied from the bent portion 22 to the first substrate 1. The electrical connection portion of the first substrate 1 is positioned at the bent portion 22 of the second substrate 2. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008193012(A) 申请公布日期 2008.08.21
申请号 JP20070028719 申请日期 2007.02.08
申请人 NEC SAITAMA LTD 发明人 NAGATA DAIGO
分类号 H05K1/14;H05K1/02 主分类号 H05K1/14
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