发明名称 |
ARRANGEMENT FOR HERMETICALLY SEALING COMPONENTS, AND METHOD FOR THE PRODUCTION THEREOF |
摘要 |
Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant. |
申请公布号 |
WO2007017404(A3) |
申请公布日期 |
2008.08.21 |
申请号 |
WO2006EP64787 |
申请日期 |
2006.07.28 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;KASPAR, MICHAEL;SCHWARZBAUER, HERBERT;WEIDNER, KARL |
发明人 |
KASPAR, MICHAEL;SCHWARZBAUER, HERBERT;WEIDNER, KARL |
分类号 |
H01L21/56;H05K3/28 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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