发明名称 LOW-PROFILE ACOUSTIC COMPONENT MOUNTING STRUCTURE, PORTABLE ACOUSTIC APPARATUS, MOBILE PHONE, LOW-PROFILE ACOUSTIC COMPONENT MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To improve sound quality by stably fixing an acoustic component without requiring the space such as an exhaustion chamber for sound quality improvement or without increasing costs even when mounting the acoustic component in a portion that is not flat, such as a step portion or an irregular portion. SOLUTION: A back side of a speaker 6 is mounted in a portion which is not flat, and a spacer 7 in such a size as to cover the speaker 6 is stuck on an apparatus substrate 5. The portion corresponding to the back side of the speaker 6 is flattened by the spacer 7. Flattening vibrates a vibrating portion of the speaker 6 and when ringing sound, stable vibration can be obtained, and particularly at low frequencies with a great amplitude, distortion reduction can be achieved and sound quality improvement can be attained. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008193613(A) 申请公布日期 2008.08.21
申请号 JP20070028509 申请日期 2007.02.07
申请人 NEC SAITAMA LTD 发明人 ASAMI KOSUKE
分类号 H04R1/02;H04M1/02;H04M1/03 主分类号 H04R1/02
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