| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device wherein a solid-state imaging element and a prism are bonded, which can solve the problem caused by bonding the solid-state imaging element and the prism with an adhesive and suppress reduction in precision of registration. SOLUTION: In a bonding structure of a solid-state imaging element and a prism, a decompressed space forming part for forming a decompressed space where the pressure is reduced lower than the ambient atmosphere is arranged in the bonding part of the solid-state imaging element and the prism. By the pressure of the decompressed space, the solid-state imaging element and the prism are bonded, thus obtaining a bonding structure without using an adhesive. COPYRIGHT: (C)2008,JPO&INPIT
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