| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a chip area is increased by planarity disposing a resistor and fusing element with respect to a semiconductor device wherein the resistor and fusing element are parallel-connected. SOLUTION: This invention relates to the semiconductor device and a method of manufacturing same wherein the fusing element is laminated on an upper portion of the resistor, and the resistor is made into a concave shape in a region where the fusing element is cut by laser. Accordingly, the stable semiconductor device is provided with a small area without causing damage to the resistor when the fusing element is cut and also with small contact resistance between respective elements. COPYRIGHT: (C)2008,JPO&INPIT
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