发明名称 METHOD AND APPARATUS FOR FORMING CONDUCTIVE PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a conductive pattern forming method capable of accurately forming a fine conductive pattern with a sufficient film thickness, without the use of photosensitive resist, or the like, and without reducing the productivity, and to provide a substrate manufacturing apparatus. SOLUTION: The conductive pattern forming method comprises: a groove forming process for forming a groove by irradiating a substrate 1 with laser light 12 via a mask 11 on which a pattern corresponding to a conductive pattern is formed; a liquid-repellent treatment process for repelling liquid from the substrate 1 after the groove forming process; a treatment process for making the groove of the substrate 1 lyophilic, which is liquid-repelled by the liquid-repellent treatment process; and a conductor forming process for forming a conductive pattern, by discharging a liquid drop of a conductive material liquid into the groove of the substrate 1 made lyophilic by the lyophilic treatment process. In the lyophilic treatment process, the groove is irradiated with a laser light 12 via the mask 11. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008192952(A) 申请公布日期 2008.08.21
申请号 JP20070027644 申请日期 2007.02.07
申请人 SEIKO EPSON CORP 发明人 MIKOSHIBA TOSHIAKI;UMETSU KAZUNARI;YOSHIMURA KAZUTO
分类号 H05K3/10 主分类号 H05K3/10
代理机构 代理人
主权项
地址