| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin film having high dimensional stability without deteriorating planarity even when receiving rapid heating in an amorphous resin film having heat resistance. SOLUTION: A method for heat-treating a film substrate comprises carrying out a heat treatment while transporting the film. The film is a film composed of an amorphous resin having≥150 to≤350°C softening point. In the method for heat-treating the film substrate, the film is transported through a heat-treating part without contact therewith. COPYRIGHT: (C)2008,JPO&INPIT
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