| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for applying a resin coating liquid to an electronic component substrate by which the apparatus cost is lowered, liquid resin is applied evenly, and high speed application is made possible and apparatus for the method. SOLUTION: The resin application method is a method for applying liquid resin to a prescribed region of a substrate and involves fixing a substrate, which is being transported, by work fixation means installed above, upward lifting a resin transfer part immersed in the resin tank installed under the substrate being transported above the liquid surface, and contacting the liquid resin held at the tip end of the resin transfer part with the electronic part substrate for transfer. COPYRIGHT: (C)2008,JPO&INPIT
|
