| 摘要 |
A semiconductor package including: a package substrate on the surface of which plural connection terminals are provided; a semiconductor chip on the surface of which plural bonding pads are provided; plural bonding wires that connect between the plural connection terminals and the plural bonding pads; a resin formed to fill a gap between the bonding wires and the surface of the semiconductor chip; and a semiconductor chip provided on the bonding wires via a film-shaped resin, wherein at least three of the plural bonding wires are formed at substantially the same heights and higher than other bonding wires.
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