SEMICONDUCTOR DEVICE

摘要

A main chip (10) is provided with a signal processing circuit (11) which performs signal processing; a plurality of signal transmitting circuits (13) for transmitting signals between the signal processing circuit (11) and a signal transmitting circuit (22); and a control circuit (14) for controlling operation/non-operation of the signal transmitting circuit (13), corresponding to the signal processing contents of the signal processing circuit (11). Each of functional chips (20A-20C) has a signal processing circuit (21) for performing auxiliary signal processing different from the signal processing performed by the signal processing circuit (11), and one or a plurality of signal transmitting circuits (22) for transmitting signals between the signal processing circuit (21) and the signal transmitting circuit (13). The main chip (10) and the functional chips (20A-20C) are arranged by being stacked. The signal transmitting circuit (13) and the signal transmitting circuit (22) are non-contact signal transmitting circuits using inductive coupling, and are arranged one over another when viewed from the stacking direction.