| 摘要 |
An osteoconductive backing implant for joint revisions is provided that m ay enhance bone healing and, for cementless implants, bony integration of th e implant. The backing implant comprises a generally planar surface that may be formed into a generally hemispherical shape. In one embodiment, the back ing implant comprises a disc having an inner hole and an outer edge, at leas t one slit extending from the inner hole to the outer edge. The disc may be formed from a coherent mass of elongate, mechanically entangled demineralize d bone particles.
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