发明名称 |
MULTILAYER FILM OF POLYIMIDE PRECURSOR SOLUTION, MULTILAYER POLYIMIDE FILM, SINGLE-SIDED METAL-CLAD LAMINATED SHEET AND MANUFACTURING METHOD OF MULTILAYER POLYIMIDE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a base material for a single-sided metal-clad laminated sheet enhanced in the adhesiveness of a high heat-resistant polyimide and a thermoplastic polyimide and also enhanced in solder heat resistance without performing any surface treatment. SOLUTION: A multilayer film of a polyimide precursor solution is constituted by laminating at least a solution layer (a) containing the thermoplastic polyimide and/or the precursor of the thermoplastic polyimide, a solution layer (b) containing a non-thermoplastic polyimide precursor and a solution layer (c) containing a heat-resistant polymer in this order and the non-thermoplastic polyimide precursor contained in the solution layer (b) is the precursor of a non-thermoplastic polyimide having a thermoplastic block component in its molecule. The multilayer polyimide film is obtained by heating or imidating the multilayer film. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008188778(A) |
申请公布日期 |
2008.08.21 |
申请号 |
JP20070022362 |
申请日期 |
2007.01.31 |
申请人 |
KANEKA CORP |
发明人 |
YANAGIDA MASAMI;KONDO YASUTAKA |
分类号 |
B32B27/34;B29C41/24;B29C41/32;B29K79/00;B29L7/00;B29L9/00;B32B15/088 |
主分类号 |
B32B27/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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