发明名称 Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member
摘要 A semiconductor device has a semiconductor element having a plurality of connection terminals, a circuit substrate electrically connected with the semiconductor element; and a connecting member arranged between the semiconductor element and the circuit substrate having a plurality of conductive projections each having a columnar portion, each of columnar portions are connected with each of connection terminals, a cross section of the columnar portion along a plane parallel to a surface of the semiconductor element being smaller than a surface area of each of connection terminals of the semiconductor element.
申请公布号 US2008197492(A1) 申请公布日期 2008.08.21
申请号 US20080068593 申请日期 2008.02.08
申请人 FUJITSU LIMITED 发明人 MIZUTANI DAISUKE
分类号 H01L23/488;H01L21/60;H05K3/00 主分类号 H01L23/488
代理机构 代理人
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