| 摘要 |
The stack has functional layers (3, 3`) provided in chips to operate the chips. Connecting units (4, 4`) are provided in each chip to provide a mechanical connection between the chips, where the units and layers are made from copper. The units stand in direct contact with the layers (3, 3`). Passivation layers (5, 5`) with an opening is applied on the layers (3, 3`), such that the opening uncovers a contact area of the layers (3, 3`). An independent claim is also included for a method for manufacturing a safety-semiconductor chip stack. |
