| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor chip in which a larger number of semiconductor chips can be laminated, as compared to those of prior art. <P>SOLUTION: The laminate structure of a semiconductor chip comprises a plurality of laminated semiconductor chips 5, and a plurality of planar substrates 7 for holding the semiconductor chips 5, respectively. At least two of the substrates 7 are arranged at the ends of the semiconductor chip 5 where the inner end faces 70 oppose each other, and at least one semiconductor chip 5<SB>1</SB>of two semiconductor chips 5 held respectively, by the two substrates 7 is held, at one end thereof, by only one substrate 7b<SB>1</SB>. The semiconductor chips 5<SB>1</SB>are stacked so that its entirety or a part in a space 17 formed by a plane M, including the lower surface 16 of a substrate 7a<SB>1</SB>and a plane L that includes the lower surface 5b of a semiconductor chip 5<SB>2</SB>on the inside of the inner end face 70 of the substrate 7a<SB>1</SB>. <P>COPYRIGHT: (C)2008,JPO&INPIT |
