| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition that can form an adhesive film having a sufficient level of heat resistance, and moisture resistance needed when a semiconductor element having a large difference in coefficient of thermal expansion is packaged on a substrate for loading semiconductors, and having the ability to suppress the volatile portions during its use, and to provide a manufacturing method thereof, adhesive film using the same, a substrate for loading semiconductor, and a semiconductor device. <P>SOLUTION: The adhesive composition comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with the epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator. A process for producing an adhesive composition comprises mixing (a) the epoxy resin, (b) the curing agent and (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin. The adhesive composition is formed into an adhesive film. A substrate for mounting semiconductor having the adhesive film disposed on a chip-mounting surface of a wiring board is provided. The adhesive film or a semiconductor device for mounting semiconductor that is made using the substrate are also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
