| 摘要 |
PROBLEM TO BE SOLVED: To provide a process of producing a semiconductor package in which electric insulation can be maintained even in an atmosphere of high temperature and high humidity and soldering junction can be achieved with high junction strength and reliability, without any necessity of cleaning removal of remaining flux after soldering junction, nor charging of under fill or the like, and provide the semiconductor package obtained by the process. SOLUTION: The process of producing the semiconductor package is characterized by including the steps of: applying a photosensitive flux to the whole area of a circuit pattern on a surface where a solder ball of the semiconductor package is mounted, drying the flux so as to form a photosensitive flux film, then placing a prescribed pattern thereon, carrying out exposure and development, thereby forming a flux pattern in a land region for mounting the solder ball of the semiconductor package; placing the solder ball on the flux pattern and carrying out soldering junction of the soldering ball with the land for mounting the soldering ball of the semiconductor package by soldering reflow; and thermally treating the semiconductor package where the soldering ball is mounted and curing the photosensitive flux. COPYRIGHT: (C)2008,JPO&INPIT |
