| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and manufacturing method thereof in which tight adhesiveness of wiring in a curved part of wiring is improved. SOLUTION: A wiring board 100 comprises: a substrate 110; first and second wiring disposed in directions different from each other; and a connection unit 143 which is disposed within a predetermined layer, connects the first and second wiring, and includes a curved line part having a side constituted of a predetermined curved line and a protruding part which is protruded from the curved line part and includes a first protruding member, and a second protruding member that is protruded from the first protruding member and smaller than the first protruding member. COPYRIGHT: (C)2008,JPO&INPIT
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