| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for fabrication in which a circuit pattern is not damaged even by performing three-dimensional fabrication of two directions or more in a drawing and the like, and a waveguide circuit board obtained by fabricating the same. SOLUTION: There are laminated a first layer (1) of a resin film composed of any one of polyimide, polyetherimide, PET and PEN; a second layer (2) composed of copper and serving as a circuit having a desired pattern; and a third layer (3) of a resin layer composed of any one of polyimide, polyetherimide, PET and PEN. Further, a seed layer is formed on a surface of the first layer (1) or the seed layer and a primer coat is formed, thereby obtaining a circuit board for fabrication in which a bond strength between the first layer (1) and the second layer (2) is 390 N/m or more, and then three-dimensional fabrication is performed by using the circuit board for fabrication, thereby manufacturing the waveguide circuit board. COPYRIGHT: (C)2008,JPO&INPIT
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