TRANSPARENT ENCAPSULATION MATERIAL AND TRANSPARENT ENCAPSULATED MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a transparent encapsulation material having high reactivity in curing and giving a transparent encapsulated material having excellent physical properties such as heat-resistance, toughness, transparency and color. SOLUTION: The transparent encapsulation material is produced by compounding (A1) 95-40 wt.% alicyclic diepoxy compound comprising 3,4,3',4'-diepoxybicyclohexyl compound expressed by formula (1) and having an isomer content of≤20%, (A2) 5-60 wt.% alicyclic epoxy resin having a functionality of≥2 and other than the alicyclic diepoxy compound (A1), 50-150 pts.wt. of a curing agent and 0.1-3.0 pts.wt. of a cure accelerator based on 100 pts.wt. of the epoxy resin composed of the components A1 and A2. In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17and R18are each independently hydrogen atom, halogen atom, oxygen atom, a hydrocarbon group which may have the halogen atom, or an alkoxy group which may have a substituent. COPYRIGHT: (C)2008,JPO&INPIT