| 摘要 |
The bump diameter of a bump electrode is reduced. An external connection substrate is bonded to a semiconductor chip, and is provided with, at an edge portion thereof, an external connection electrode protruding from the semiconductor chip, and continuing on both principal surfaces of the external connection substrate. The external connection electrode on a principal surface side of the external connection substrate is connected to the bump electrode through an opening in a resin layer covering the external connection electrode. The external connection electrode on the other principal surface is connected to a conductive path of a mounting board. The chip and the external connection substrate are fixed together by an underfill material. The external connection electrode and the conductive path are fixed together by solder. The bonding strength can be improved even with a reduced bump diameter so that the chip can be reduced in size.
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