发明名称 |
COMPOSITIONS FOR THIN CIRCUIT MATERIALS, CIRCUITS, MULTI-LAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF |
摘要 |
A composition for the manufacture of a circuit material comprises a solvent composition having a boiling point below 160° C.; an epoxy compound having an average epoxy functionality of greater than one, an epoxy equivalent weight of less than about 6,000 Daltons, a softening point of less than about 160° C., and solubility in the solvent composition; an aromatic polymer co-curable with the epoxy compound, and soluble in the solvent composition; and, optionally, a catalyst for the polymerization of epoxy groups. The composition for the manufacture of a circuit material can further comprise a filler additive and/or a flame retardant additive.
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申请公布号 |
US2008200084(A1) |
申请公布日期 |
2008.08.21 |
申请号 |
US20080031310 |
申请日期 |
2008.02.14 |
申请人 |
ANGUS RICHARD O;BARTON CARLOS L;GUO DAVID H |
发明人 |
ANGUS RICHARD O.;BARTON CARLOS L.;GUO DAVID H. |
分类号 |
B32B5/02;B05D3/02;B32B15/08;B32B27/38;B32B37/00;C08G59/00;C08G73/00;C08G75/00;C08K3/10;C08K3/22;C08K3/32 |
主分类号 |
B32B5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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