METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE
摘要
The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.
申请公布号
WO2008098269(A1)
申请公布日期
2008.08.21
申请号
WO2008AT00027
申请日期
2008.01.30
申请人
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT;WEIDINGER, GERALD;LEITGEB, MARKUS;STAHR, JOHANNES;WEICHSLBERGER, GUENTHER;ZLUC, ANDREAS
发明人
WEIDINGER, GERALD;LEITGEB, MARKUS;STAHR, JOHANNES;WEICHSLBERGER, GUENTHER;ZLUC, ANDREAS