发明名称 Method for soldering components of a heat exchanger in a layer formation comprises stacking sheet metal layers and covering plates to form a stack with front sides, applying a solder to one of the front sides and further processing
摘要 <p>Method for soldering components of a heat exchanger (1) in a layer formation comprises stacking sheet metal layers (7) and covering plates (5) to form a stack (3) with front sides, applying a solder to one of the front sides (111), soldering the sealing surfaces of the sheet metal layers and the covering layers and producing a solder flow from one of the front sides over the sealing surfaces in the direction of the inside of the stack up to solder flow barriers of the heat exchanger. An independent claim is also included for a heat exchanger in a layer formation.</p>
申请公布号 DE102007008341(A1) 申请公布日期 2008.08.21
申请号 DE20071008341 申请日期 2007.02.20
申请人 BEHR GMBH & CO. KG 发明人 ANGERMANN, HANS-HEINRICH
分类号 B23K1/14;B21D53/02;B23K35/14;B23P15/26;F01N3/24 主分类号 B23K1/14
代理机构 代理人
主权项
地址