发明名称 Soft solder, useful e.g. in electronics and electrical sectors, comprises solder material mass coated with non-corrosive flux material, preferably based on carrier resin and plasticizer
摘要 <p>A solder (A) comprises a mass of soft solder material (I), with at least part of the outer surface covered by an adherent, non-sticky coating of a non-corrosive flux material (II). Independent claims are included for: (1) the production of (A), by coating the mass of (I) with a liquefied mixture of all of the components of (II), if necessary removing excess (II) and drying; and (2) a flux (II') for soft soldering, comprising (by weight) (a) 50-95% carrier resin, (b) 0.1-15% plasticizer, (c) 0-10% activator, (d) 0-30% extender, (e) 0-1% wetting agent and (f) 0-50% solvent.</p>
申请公布号 DE102007007212(A1) 申请公布日期 2008.08.21
申请号 DE20071007212 申请日期 2007.02.14
申请人 STANNOL GMBH 发明人
分类号 C09D193/04;B23K35/14 主分类号 C09D193/04
代理机构 代理人
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