METHOD AND APPARATUS FOR PERFORMING HEAT DISSIPATION OF ELECTRIC COMPONENT ON CIRCUIT BOARD

摘要

The invention discloses one method for heat dissipation in circuit board electron part, which comprises the following steps: dividing the circuit board electron part into multiple sets; through circuit board to form wind guide channel to let gas flow into each electron part far from the wind intake guide; through forming wind exit guide channel to guide the gas flow each electron part gas flow into out of circuit board to make one set of electron gas flow not through other set electron parts. The invention avoids heat overlap each other in the direction of the airflow to improve dissipation effect. The invention also discloses a circuit board, an airflow distributing equipment and communicating equipment.