| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lamp that increases the degree of integration in an LED chip sealed with resin, can supply required power, and can radiate generated heat effectively. <P>SOLUTION: The LED lamp 10 comprises: a plate-like chip-side lead 12 and a counter-electrode-side lead 14; a chip mounting section 16 provided at an edge 12A of the chip-side lead 12; LED chips 18A-18D on the chip mounting section 16; a bonding wire 20 for connecting the LED chips 18A-18D to the counter-electrode-side lead 14; and a sealing resin section 22 for sealing them except cathode- and anode-side terminals 13, 15. <P>COPYRIGHT: (C)2008,JPO&INPIT |
