| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connecting structure eliminating a mulfunction without having the influence of noise on electronic apparatuses when performing hot docking between the electronic apparatuses. <P>SOLUTION: When the first electronic apparatus 10 having a first EMI shielding part 113 is docked with the second electronic apparatus 50 having a second EMI shielding part 143, ESD contact parts, which are connected to the second EMI shielding part and larger in impedance than EMI connecting parts, are brought into contact with the first EMI shielding part earlier than the EMI connecting parts connected to the second EMI shielding part. Static charges charged in the first EMI shielding part are calmly moved to the second EMI shielding part by the high impedance of the ESD contact parts. Thus, a fault due to the ESD does not occur. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
