发明名称 MULTI-LAYERED STENTS AND METHODS OF IMPLANTING
摘要 <p>A method of percutaneously delivering a multi-layered stent assembly to a desired implantation location of a patient including the steps of radially compressing a multi-layered stent assembly to a compressed size for implantation in a patient, the multi-layered stent assembly including a first stent (52), a second stent (54) coaxially positioned within at least a portion of a length of the first stent, and a valve, wherein the first stent comprises at least one different material property than the second stent. The method further includes delivering the multi-layered stent assembly to the desired implantation location of the patient using a delivery system and substantially simultaneously expanding the first stent and the second stent of the multi-layered stent assembly at the desired implantation location to a radially expanded size that is larger than the compressed size.</p>
申请公布号 WO2008100599(A1) 申请公布日期 2008.08.21
申请号 WO2008US02049 申请日期 2008.02.15
申请人 MEDTRONIC, INC.;BONHOEFFER, PHILIPP;SCHIEVANO, SILVIA;RYAN, TIMOTHY, R.;LASKE, TIMOTHY, G. 发明人 BONHOEFFER, PHILIPP;SCHIEVANO, SILVIA;RYAN, TIMOTHY, R.;LASKE, TIMOTHY, G.
分类号 A61F2/24;A61F2/90 主分类号 A61F2/24
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