| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of securing its high reliability, a manufacturing method thereof, and electronic equipment. SOLUTION: The strength of a substrate 2 is improved in the region having a provided reinforcing portion 4 since the reinforcing portion 4 for reinforcing the substrate 2 is so provided on the surface layer of the substrate 2 as to surround by it a thin-film circuit layer 3. For example, even when notches 21 are formed in the cut portion of the substrate 2 by subjecting the semiconductor device to a multiple chamfering, the cracks 22 generated from the notches 21 are so checked by the reinforcing portion 4 as to be able to prevent the cracks 22 from extending to the thin-film circuit layer 3. Thereby, the semiconductor device capable of securing its high reliability can be obtained. COPYRIGHT: (C)2008,JPO&INPIT |
