| 摘要 |
PROBLEM TO BE SOLVED: To provide a breaking method of an adhesive film, for sticking the broken pieces of the adhesive film to the surface of a device when extending a dicing tape and breaking the adhesive film along each device. SOLUTION: The breaking method of the adhesive film for breaking the adhesive film mounted on the back surface of a wafer where the device is formed in a plurality of regions sectioned by a plurality of streets and provided with an outer shape larger than the outer shape of the wafer along the device in the state of being stuck to the surface of the dicing tape includes: an outer peripheral part cutting process of cutting the outer peripheral part projected from the outer peripheral edge of the wafer in the adhesive film stuck to the surface of the dicing tape along the outer peripheral edge of the wafer; an outer peripheral part removing process of peeling the outer peripheral part of the adhesive film cut by the outer peripheral part cutting process from the dicing tape; and a tape extending process of extending the dicing tape mounted on an annular frame and breaking the adhesive film along the device after executing the outer peripheral part removing process. COPYRIGHT: (C)2008,JPO&INPIT
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