发明名称 BONDING METHOD, METHOD FOR PRODUCING LIQUID DROPLET DISCHARGE HEAD AND METHOD FOR PRODUCING ELECTROCHEMICAL PANEL
摘要 PROBLEM TO BE SOLVED: To provide a bonding method for readily controlling a gap between both substrates and uniforming the layer thickness of an adhesion layer and to provide a method for producing a liquid droplet discharge head and a method for producing an electrooptical panel. SOLUTION: The bonding method comprises a coating process for applying a mixed adhesive 55 to the adhesion area of a nozzle substrate 11, a spacer formation process for partially curing an area corresponding to the peripheral part of a nozzle opening part 21 in the coated mixed adhesive 55 and forming a plurality of spacer parts 22a, a laminating process for laminating the nozzle substrate 11 to a flow channel formation substrate 12 and a curing process for curing the whole mixed adhesive 55 to form an adhesion layer 22. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008189728(A) 申请公布日期 2008.08.21
申请号 JP20070023439 申请日期 2007.02.01
申请人 SEIKO EPSON CORP 发明人 MATSUO YASUHIDE
分类号 C09J5/00;B41J2/16;C09J5/06;C09K3/10 主分类号 C09J5/00
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