Structured resist layer manufacturing method for structuring e.g. reticle mask substrate, involves lithographically exposing resist layer covered with inorganic layer, and structuring resist layer by etching to form structured layer

摘要

The method involves forming an inorganic layer (5) on a resist layer (4), and selecting thickness of the inorganic layer and a material of the layer in such a manner that the inorganic layer is permeable to electromagnetic beams, which is used for exposure to the resist layer. The resist layer is lithographically exposed, where the resist layer is covered with the inorganic layer. The resist layer is structured by etching, so that a structured resist layer is formed.